CD型低阻精密贴片电阻器
CD型低阻精密贴片电阻器性能
FC型 - 用于表面贴装应用的倒装芯片版本。
WB 型 - 用于混合应用的引线键合版本,具有用于芯片焊接散热的金属化背面,包括用于接收铝引线键合的可键合端接基座。
在±1%时电阻低至 0.010 ohm;
此设计中的基座端子提供了一个超低电阻连接焊盘,可在连接到电阻芯片的点上保持 0.010Ω ±1% 的精度;
带有铜芯的基座端子还提供热扩散,从而增强了高功率处理能力;
当使用更高热导率的电路板基板(例如 IMS 或氧化铝)时,提供热阻以优化高功率设计。
The special performance features
• Style FC - Flip Chip version for surface mount applications.
Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pedestals to receive aluminum wire bonds.
• Resistance as low as 0.010 ohm at ±1%.
• Pedestal terminals in this design provide an ultra low resistance connection pad which maintains the precision 0.010Ω ±1% at the point of customer Kelvin connection to the resistor chip. The pedestal terminal with its copper core also provides heat spreading which enhances the high power handling capability.
• Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina.
• High pulse handling and overload capability.
• Low inductance provides excellent high frequency and pulse response.
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